A new PS3 heat sink that will reduce the weight of the console and increase system efficiency is in development.
Furukawa Electric exhibited the “third generation” PS3 heat sink at Techno-Frontier 2008 in Japan earlier this month, reports
TechOn. The heat sink is characterized by its small size, light weight and low cost.
The report says that separate heat sinks will for the first time be used to cool the PS3’s Cell microprocessor and RSX graphics chips. The separate heat sinks will weigh in at about 350g in total, in comparison to 700g and 500g for the first and second designs used in PS3s.
Furukawa Electric says it has managed to remove a number of components from the older heat sinks, including copper heat pipes, without reducing heat radiation performance. The new heat sink will feature only three types of components, while more than 20 were featured in first generation PS3 heat sinks and about 10 in the second.
Earlier this week analysts at the wholesale investment bank Nikko Citigroup
said they expected Sony to begin making a profit on PlayStation 3 units from August. It has been speculated that profit-making PS3s will likely feature sub-65nm cell processors, sub-90nm RSX graphics chips, or both, since the smaller chips are cheaper to manufacturer.
The size reduction of PS3 components could lead to the introduction of the rumored PS3 Slim down the line, and also to potential hardware price cuts.
Social Networking Bookmarks